Integrated Circuit Anti-Static Packaging Box/ IC Anti-Static Packaging Box
| Negotiable | 2,000 Pieces (MOQ) |
Min. Order:
2,000 Pieces
Port:
Shanghai, China
Payment Terms:
T/T, Paypal
Shanghai, China
Last Login Date:
Jan 25, 2024
Business Type:
Manufacturer/Factory, Trading Company
Main Products:
Vacuum Pick-up Tool, Vacuum Release Gel Box, Gel Box, Integrated Circuit Anti-Static Packaging Box
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Product Description
Company Info
Address:
102 Room, 1901# Xincun Road Putuo District, Shanghai, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Packaging & Printing
Main Products:
Vacuum Pick-up Tool, Vacuum Release Gel Box, Gel Box, Integrated Circuit Anti-Static Packaging Box
Company Introduction:
Tongze Machinery Co., Ltd. Was established in 2016 and is an enterprise specializing in the development and production of anti-static packaging products.
The company focus on the production of semiconductor integrated circuit packaging products. At the beginning of its establishment, the company invested heavily in the research and development of chip packaging products. After several years of hard work, it has successfully developed a variety of chip packaging products. Covers the packaging applications of bare chips, ceramic integrated circuits, plastic integrated circuits, electronic modules, etc., especially for bare chip packaging products. The company′s self-developed products have reached the quality level of imported products and have obtained a number of patents.
The company′s products have passed the testing of the national authoritative testing organization, and have reached national standards in terms of environmental protection, reliability, and anti-static performance. The company′s products have been widely used in domestic scientific research institutes and chip design companies, and the product quality has been unanimously praised by users.
The company focus on the production of semiconductor integrated circuit packaging products. At the beginning of its establishment, the company invested heavily in the research and development of chip packaging products. After several years of hard work, it has successfully developed a variety of chip packaging products. Covers the packaging applications of bare chips, ceramic integrated circuits, plastic integrated circuits, electronic modules, etc., especially for bare chip packaging products. The company′s self-developed products have reached the quality level of imported products and have obtained a number of patents.
The company′s products have passed the testing of the national authoritative testing organization, and have reached national standards in terms of environmental protection, reliability, and anti-static performance. The company′s products have been widely used in domestic scientific research institutes and chip design companies, and the product quality has been unanimously praised by users.
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